Mefuta e fapaneng ea boholo bo Fused Silica Wafers

Custom Fapaneng Sizes Fused Silica Wafers Featured Image

Tlhaloso e Khutšoanyane:

lintho tse bonahalang: Silika e kopantsoeng
Bohloeki bo phahameng: SiO2> 99.99%
Qetello ea Bokaholimo: Mahlakore a mabeli a bentšitsoe
Boleng ba Sefahleho: 60/40
Sebopeho: Round
Matla a Phepelo: 150000 Piece / Likotoana ka Khoeli

Re romelle lengolo-tsoibila

Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

Mefuta e fapaneng ea boholo bo Fused Silica Wafers

Tlhaloso ea Li-Wafers tsa Quartz

Che.	Lebitso	Boholo	Yuniti
1	OD Diameter	150±0.2	mm
2	Botenya	1.0±0.1	mm
3	OF	47.5±2.5	mm
4	Ho benya	Kereiti ea Optical	60/40
5	Bophatlalatsi	<25	μm
6	KOBANE	<25	μm
7	TTV	<10	μm
8	OH	200-500	ppm
9	Ntlheng (A)	0.5±0.1 limilimithara
	Chamfer(C)	0.3±0.1 limilimithara
	Boemo(A&C)	Rrms <0.03μm
	Lenaka	45°±5°

Setšoantšo sa Li-Wafers tse Fused Quartz

Lintho tsa Optical tsa Khalase ea Quartz

Likopo tsa Liphaephe tse Fused Silica

UV e tloaelehileng, CTE e tlaase, optoelectronic, mocheso o phahameng, litšoantšo tsa mocheso, tekanyo le theknoloji ea sensor, astronomical, microlithography, MEMS, Excimer le Nd: YAG lisebelisoa tsa laser, le moo ho hlokahalang li-wafers tsa silika tsa boemo bo holimo.

Lead time

Bakeng sa likarolo tsa stock, re tla romelloa ka har'a beke e le 'ngoe.Bakeng sa likarolo tse ikhethileng, ka kopo ikopanye le rona bakeng sa tlhaiso-leseling e batsi.Haeba o hloka ka potlako, re tla hlophisa pele.